But Apple’s claim of achieving a superior solution will resonate.Īpple says its tech delivers 4x the bandwidth of competing interposer technologies.Īnother important element to Apple’s invention is that developers won’t need to rewrite their code to use this power UltraFusion means that, on a system level, the Mac sees the chip as a single processor, not two. Its approach isn’t unique AMD and others have also developed silicon interposer interconnection tech for their PC chips. (I imagine Apple may have used TSMC’s 3DFabric technology to achieve UltraFusion.)Īpple won what appears to be its first related design patent in March 2021, though work began earlier. To do so, UltraFusion uses a silicon interposer with twice the connection density “of any technology available,” said Srouji.Ī silicon interposer is basically an in-package interconnect that bridges the two dies used in M1 Ultra. That interconnect uses a proprietary packaging architecture Apple calls UltraFusion. Apple describes this as “way ahead” of the industry and claims it can shuttle data around the chip at 2.5 terabytes per second of low latency, inter-processor bandwidth, which is fast. (I seem to recall this was spotted by others at some point, but can’t find a reference.) What is UltraFusion? He pointed out a die-to-die interconnect tech that was always on the M1 Max, something Apple has not discussed before. Srouji moved on to explain how the company has managed to combine two M1 Max chips into one M1 Ultra. He also said the M1 Ultra “completes the family” of Mac processors - at least for now.
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